TECHNOLOGY

CAPABILITIES

CAPABILITYUnitStandardAdvanced
Max layer 2460
Outerlayer Track / Space µm100 / 10035 / 35
Innerlayer Track / Spaceµm76 / 76 35 / 35
Min – Max PCB Thickness mm0.20 – 3.200.05 – 6.00
Min – Max Cu Thicknessµm12 – 3509 – 1000
Max PCB Dimensions mm520 x 610570 x 1200
Max Aspect Ratio 12 : 1 16 : 1
Impedance Control %± 10 ± 5
HDI Structure 3 + n + 3 6 + n + 6
IMS Thermal Conductivity (Alu) W/mK1.0 – 3.01.0 – 8.0
IMS Alu core Thickness mm1.0 – 2.00.4 – 3.0
TECHNOLOGY
Via in Pad Stacked Micro Via’s Cu plated Micro Via’sResin filled Via’s
Capped Via’s Every Layer Interconnect Chip On Board Edge Plating
Gold Finger FlexFlex-Rigid Embedded Capacitance
IMS Insulated Holes
SURFACE FINISH
HASLHASL – Lead Free ENIGFlash Gold
Hard Gold Immersion AgImmersion SnOSP
ENEPIGCarbon InkPeelable MaskKapton Tape
MATERIAL
FR4 Tg 135 FR4 Tg 150FR4 Tg 180FR2
CEM3Halogen FreePTFEHybrid
CTI > 600V Alu Substrate Cu Substrate Glass Substrate
Polyimide

TECHNOLOGY

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