TECHNOLOGY

CAPABILITIES

CAPABILITY Unit Standard Advanced
Max layer 24 60
Outerlayer Track / Space µm 100 / 100 35 / 35
Innerlayer Track / Space µm 76 / 76 35 / 35
Min – Max PCB Thickness mm 0.20 – 3.20 0.05 – 6.00
Min – Max Cu Thickness µm 12 – 350 9 – 1000
Max PCB Dimensions mm 520 x 610 570 x 1200
Max Aspect Ratio 12 : 1 16 : 1
Impedance Control % ± 10 ± 5
HDI Structure 3 + n + 3 6 + n + 6
IMS Thermal Conductivity (Alu) W/mK 1.0 – 3.0 1.0 – 8.0
IMS Alu core Thickness mm 1.0 – 2.0 0.4 – 3.0
TECHNOLOGY
Via in Pad Stacked Micro Via’s Cu plated Micro Via’s Resin filled Via’s
Capped Via’s Every Layer Interconnect Chip On Board Edge Plating
Gold Finger Flex Flex-Rigid Embedded Capacitance
IMS Insulated Holes
SURFACE FINISH
HASL HASL – Lead Free ENIG Flash Gold
Hard Gold Immersion Ag Immersion Sn OSP
ENEPIG Carbon Ink Peelable Mask Kapton Tape
MATERIAL
FR4 Tg 135 FR4 Tg 150 FR4 Tg 180 FR2
CEM3 Halogen Free PTFE Hybrid
CTI > 600V Alu Substrate Cu Substrate Glass Substrate
Polyimide

TECHNOLOGY

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