TECHNOLOGY
CAPABILITIES
| CAPABILITY | Unit | Standard | Advanced | |
| Max layer | 24 | 60 | ||
| Outerlayer Track / Space | µm | 100 / 100 | 35 / 35 | |
| Innerlayer Track / Space | µm | 76 / 76 | 35 / 35 | |
| Min – Max PCB Thickness | mm | 0.20 – 3.20 | 0.05 – 6.00 | |
| Min – Max Cu Thickness | µm | 12 – 350 | 9 – 1000 | |
| Max PCB Dimensions | mm | 520 x 610 | 570 x 1200 | |
| Max Aspect Ratio | 12 : 1 | 16 : 1 | ||
| Impedance Control | % | ± 10 | ± 5 | |
| HDI Structure | 3 + n + 3 | 6 + n + 6 | ||
| IMS Thermal Conductivity (Alu) | W/mK | 1.0 – 3.0 | 1.0 – 8.0 | |
| IMS Alu core Thickness | mm | 1.0 – 2.0 | 0.4 – 3.0 | |
| TECHNOLOGY | |||||||
| Via in Pad | Stacked Micro Via’s | Cu plated Micro Via’s | Resin filled Via’s | ||||
| Capped Via’s | Every Layer Interconnect | Chip On Board | Edge Plating | ||||
| Gold Finger | Flex | Flex-Rigid | Embedded Capacitance | ||||
| IMS Insulated Holes | |||||||
| SURFACE FINISH | |||||||
| HASL | HASL – Lead Free | ENIG | Flash Gold | ||||
| Hard Gold | Immersion Ag | Immersion Sn | OSP | ||||
| ENEPIG | Carbon Ink | Peelable Mask | Kapton Tape | ||||
| MATERIAL | |||||||
| FR4 Tg 135 | FR4 Tg 150 | FR4 Tg 180 | FR2 | ||||
| CEM3 | Halogen Free | PTFE | Hybrid | ||||
| CTI > 600V | Alu Substrate | Cu Substrate | Glass Substrate | ||||
| Polyimide | |||||||
TECHNOLOGY
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